SN74CB3T3384_15 Datasheet, PDF (1/19 Pages) Texas Instruments – 10-BIT FET BUS SWITCH 2.5-V/3.3-V LOW-VOLTAGE BUS SWITCH WITH 5-V-TOLERANT LEVEL SHIFTER

SN74CB3T3384
10ĆBIT FET BUS SWITCH
2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTER
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
D Output Voltage Translation Tracks V_CC
D Supports Mixed-Mode Signal Operation On
All Data I/O Ports
− 5-V Input Down To 3.3-V Output Level
Shift With 3.3-V V_CC
− 5-V/3.3-V Input Down To 2.5-V Output
Level Shift With 2.5-V V_CC
D 5-V-Tolerant I/Os With Device Powered-Up
or Powered-Down
D Bidirectional Data Flow, With Near-Zero
Propagation Delay
D Low ON-State Resistance (r_on)
Characteristics (r_on = 5 Ω Typical)
D Low Input/Output Capacitance Minimizes
Loading (C_io(OFF) = 5 pF Typical)
D Data and Control Inputs Provide
Undershoot Clamp Diodes
D V_CC Operating Range From 2.3 V to 3.6 V
D Data I/Os Support 0 to 5-V Signaling Levels
(For Example: 0.8-V, 1.2-V, 1.5-V, 1.8-V,
2.5-V, 3.3-V, 5-V)
D Control Inputs Can Be Driven by TTL or
5-V/3.3-V/2.5-V CMOS Outputs
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 250 mA Per
JESD 17
D ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
D Supports Digital Applications: Level
Translation, Memory Interleaving, Bus
Isolation
D Low Power Consumption
(I_CC = 40 µA Max)
D Ideal for Low-Power Portable Equipment
DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1OE 1
1B1 2
1A1 3
1A2 4
1B2 5
1B3 6
1A3 7
1A4 8
1B4 9
1B5 10
1A5 11
GND 12
24 V_CC
23 2B5
22 2A5
21 2A4
20 2B4
19 2B3
18 2A3
17 2A2
16 2B2
15 2B1
14 2A1
13 2OE
description/ordering information
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC − DW
Tube
Tape and reel
SN74CB3T3384DW
SN74CB3T3384DWR
CB3T3384
−40°C to 85°C
SSOP (QSOP) − DBQ
TSSOP − PW
Tape and reel
Tube
Tape and reel
SN74CB3T3384DBQR
SN74CB3T3384PW
SN74CB3T3384PWR
CB3T3384
KS384
TVSOP − DGV
Tape and reel SN74CB3T3384DGVR
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are}
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright  2004, Texas Instruments Incorporated
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