DRV8833 Datasheet, PDF (1/22 Pages) Texas Instruments – DUAL H-BRIDGE MOTOR DRIVER

DRV8833
www.ti.com
SLVSAR1B – JANUARY 2011 – REVISED AUGUST 2011
DUAL H-BRIDGE MOTOR DRIVER
Check for Samples: DRV8833
FEATURES
1
•2 Dual-H-Bridge Current-Control Motor Driver
– Capable of Driving Two DC Motors or One
Stepper Motor
– Low MOSFET On-Resistance:
HS + LS 360 mΩ
• Output Current 1.5-A RMS, 2-A Peak per
H-Bridge (at V_M = 5 V, 25°C)
• Outputs Can Be Paralleled for 3-A RMS,
4-A Peak
• Wide Power Supply Voltage Range:
2.7 V – 10.8 V
• PWM Winding Current Regulation/Limiting
• Thermally Enhanced Surface Mount Package
APPLICATIONS
• Battery-Powered Toys
• POS Printers
• Video Security Cameras
• Office Automation Machines
• Gaming Machines
• Robotics
DESCRIPTION
The DRV8833 provides a dual bridge motor driver solution for toys, printers, and other mechatronic applications.
The device has two H-bridge drivers, and can drive two DC brush motors, a bipolar stepper motor, solenoids, or
other inductive loads.
The output driver block of each H-bridge consists of N-channel power MOSFET’s configured as an H-bridge to
drive the motor windings. Each H-bridge includes circuitry to regulate or limit the winding current.
With proper PCB design, each H-bridge of the DRV8833 is capable of driving up to 1.5-A RMS (or DC)
continuously, at 25°C with a VM supply of 5 V. It can support peak currents of up to 2 A per bridge. Current
capability is reduced slightly at lower VM voltages.
Internal shutdown functions with a fault output pin are provided for over current protection, short circuit
protection, under voltage lockout and overtemperature. A low-power sleep mode is also provided.
The DRV8833 is packaged in a 16-pin HTSSOP or QFN package with PowerPAD™ (Eco-friendly: RoHS & no
Sb/Br).
PACKAGE ⁽²⁾
PowerPAD™ (HTSSOP) - PWP
PowerPAD™ (QFN) - RTY
ORDERING INFORMATION⁽¹⁾
ORDERABLE PART
NUMBER
Reel of 2000
DRV8833PWPR
Tube of 90
DRV8833PWP
Reel of 3000
DRV8833RTYR
Reel of 250
DRV8833RTYT
TOP-SIDE
MARKING
DRV8833
DRV8833
(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated