DLKPC192S Datasheet, PDF (1/25 Pages) Texas Instruments – 10-Gbps ETHERNET LAN PHYSICAL CODING SUBLAYER (PCS) WITH SSTL XGMII INTERFACE

DLKPC192S
10ĆGbps ETHERNET LAN PHYSICAL CODING SUBLAYER (PCS)
WITH SSTL XGMII INTERFACE
SLLS536 − AUGUST 2002
D 10-Gbps Ethernet LAN PCS With 64b/66b
ENDEC
D 10-Gbps Media-Independent Interface
(XGMII) Using 2.5-V SSTL Class 2
Technology
D 10-Gbps 16-Bit Interface (XSBI) Using LVDS
Technology
D IEEE 802.3 Management Data Interface
(MDIO)
D Advanced 0.18-µm CMOS Technology
D Less Than 1.5 W Power Consumption
D Low-Cost 289-Ball PBGA Package
description
The DLKPC192S performs all physical coding sublayer (PCS) functions for proposed IEEE 802.3ae/D2.0
10-Gbps Ethernet serial network (LAN) connections.
The DLKPC192S connects to the media access control (MAC) and all higher layers of the OSI protocol stack
via the 10-Gbps media independent interface (XGMII). The XGMII consists of two unidirectional buses, each
with 36 information bits (32 data bits, 4 control bits) plus a clock. The XGMII interface is implemented using
2.5-V, SSTL Class 2 technology. The DLKPC192S connects to physical media via the 10-Gbps 16-bit interface
(XSBI). The XSBI bus consists of two unidirectional buses, each with 16 data bits plus a clock. The XSBI
interface is implemented utilizing low-voltage differential signaling (LVDS) technology. The DLKPC192S
encodes and decodes data using the 64b/66b coding algorithm and provides clock tolerance compensation
when needed.
XGMII
Clk _TC
32
TD[0:31]
4
KG[0:3]
XSBI
DLKPC192S
TXCP/N ^Clk
16
TXD[0:15]P/N
16:1
TX MUX
E/O
MAC
10-Gbps Ethernet
ASIC
Clk _RC
32 _RD[0:31]
Physical
Coding Sublayer
RXCP/N ^Clk
1:16
16
CDR/
O/E
4 _KF[0:3]
RXD[0:15]P/N
Deserializer
RFCP/N MDIO MDC XBICP/N
6”
OSC.
3”
OSC.
Management
Figure 1. 10-Gbps Ethernet Short-PCB-Distance Implementation
The DLKPC192S can be used in systems where printed-circuit board (PCB) traces between the media access
control device and the serializer/deserializer device are sufficiently short, as shown in Figure 1.
Systems requiring PCB traces longer than 6 inches can be implemented by using the TLK3114SA XGMII
external sublayer device to increase the allowable PCB trace length to greater than 20 inches, as shown in
Figure 2.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright  2002, Texas Instruments Incorporated
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