CD74FCT240_16 Datasheet, PDF (1/12 Pages) Texas Instruments – BiCMOS OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

D BiCMOS Technology With Low Quiescent
Power
D Buffered Inputs
D Inverted Outputs
D Input/Output Isolation From V_CC
D Controlled Output Edge Rates
D 64-mA Output Sink Current
D Output Voltage Swing Limited to 3.7 V
D SCR Latch-Up-Resistant BiCMOS Process
and Circuit Design
D Package Options Include Plastic
Small-Outline (M) and Shrink Small-Outline
(SM) Packages and Standard Plastic (E) DIP
CD74FCT240
BiCMOS OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCBS729 − JULY 2000
E, M, OR SM PACKAGE
(TOP VIEW)
1OE ₁
1A1 ₂
2Y4 3
1A2 4
2Y3 5
1A3 6
2Y2 7
1A4 8
2Y1 9
GND 10
20 ^VCC
19 ^2OE
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 2A2
12 1Y4
11 2A1
description
The CD74FCT240 is an octal buffer/line driver with 3-state outputs, using a small-geometry BiCMOS
technology. The output stages are a combination of bipolar and CMOS transistors that limit the output high level
to two diode drops below V_CC. This resultant lowering of output swing (0 V to 3.7 V) reduces power-bus ringing
[a source of electromagnetic interference (EMI)] and minimizes V_CC bounce and ground bounce and their
effects during simultaneous output switching. The output configuration also enhances switching speed and is
capable of sinking 64 mA.
The CD74FCT240 is organized as two 4-bit buffers/line drivers with separate active-low output-enable (OE)
inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs
are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The CD74FCT240 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each buffer/driver)
INPUTS
OE
A
OUTPUT
Y
L
H
L
L
L
H
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright © 2000, Texas Instruments Incorporated
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