TUSB6020 Datasheet, PDF (9/12 Pages) Texas Instruments – USB 2.0 HIGH-SPEED ON-THE-GO DUAL-ROLE CONTROLLER

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TUSB6020
USB 2.0 HIGH-SPEED ON-THE-GO DUAL-ROLE CONTROLLER
SCPS170C – JANUARY 2007 – REVISED JULY 2007
CRYSTAL REQUIREMENTS
Frequency
The required frequency of oscillation for the crystal can be 19.200, 24.000, or 48.000 MHz.
Frequency Tolerances
Frequency tolerance is the maximum allowable deviation from the nominal crystal frequency at a specified
temperature, usually 25°C. The recommended frequency tolerance of the crystal over the manufacturing process
is ±50 ppm. The maximum acceptable frequency tolerance of the crystal over the manufacturing process is
±100 ppm.
NOTE
The total system frequency tolerance from the crystal, the load capacitors, the
capacitive load of the board, the capacitive load of the device pins, the variation over
temperature, the variation with age, and the circuitry of the PHY must be less than
±500 ppm. Consequently, the individual tolerance for the crystal must be ≤ ±100 ppm.
Load Capacitance
The oscillator of the USB device may have difficulty driving a large load capacitance, so crystals that specify
large load capacitances should be avoided. For more information on crystal requirements, see the following
application report from TI: Selection and Specification of Crystals for Texas Instruments USB 2.0 Devices
(literature number SLLA122).
Mechanical Characteristics
The TUSB6020 controller uses an 80-pin MicroStar BGA™ package. The lead-free solder ball composition is
Sn/Ag1.2Cu0.5 (proportions by weight). The substrate plating on the die side where the die bonds to is NiAu.
The substrate finish on the bottom side where the solder balls attach to is bare Cu.
Reflow Conditions
(°C)
MicroStar BGA™/MicroStarJunior™
Recommended Lead Free Reflow Profile
In the case of Sn/Ag/Cu solder paste
260
Peak temperature
260°C max
235
225
200
30 – 60 s
150
90 ± 30 s
1–5 °C/sec
Reflow temperature is defined at package top.
Figure 2. Reflow Conditons
Time
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