CC2540T_15 Datasheet, PDF (9/37 Pages) Texas Instruments – SimpleLink CC2540T 2.4-GHz Bluetooth Low Energy Wireless MCU

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CC2540T
SWRS172 – JULY 2014
4.4 Electrical Characteristics
Measured on Texas Instruments CC2540 EM reference design with T_A = 25°C and VDD = 3 V
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-
MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and
235
sleep timer active; RAM and register retention
I_core Core current consumption
Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-
MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep
timer active; RAM and register retention
0.9
µA
Power mode 3. Digital regulator off; no clocks; POR active;
RAM and register retention
0.4
Low MCU activity: 32-MHz XOSC running. No radio or
peripherals. No flash access, no RAM access.
6.7
mA
Timer 1. Timer running, 32-MHz XOSC used
90
μA
Timer 2. Timer running, 32-MHz XOSC used
Peripheral current consumption
Timer 3. Timer running, 32-MHz XOSC used
I_peri
(Adds to core current I_core for each
peripheral unit activated)
Timer 4. Timer running, 32-MHz XOSC used
Sleep timer, including 32.753-kHz RCOSC
90
μA
60
μA
70
μA
0.6
μA
ADC, when converting
1.2
mA
4.5 Thermal Resistance Characteristics for RHA Package
NAME
DESCRIPTION
°C/W ^{(1) (2)}
AIR FLOW (m/s)⁽³⁾
RΘ_JC
RΘ_JB
RΘ_JA
RΘ_JMA
Psi_JT
Psi_JB
Junction-to-case
Junction-to-board
Junction-to-free air
Junction-to-moving air
Junction-to-package top
Junction-to-board
16.1
0.00
5.5
0.00
30.6
0.00
0.2
0.00
5.4
0.00
1.0
0.00
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ_JC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
(3) m/s = meters per second.
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