SN74CB3Q3257_08 Datasheet, PDF (8/18 Pages) Texas Instruments – 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH

www.ti.com
PACKAGE OPTION ADDENDUM
24-May-2007
PACKAGING INFORMATION
Orderable Device
74CB3Q3257DBQRE4
74CB3Q3257DBQRG4
74CB3Q3257DGVRE4
74CB3Q3257DGVRG4
74CB3Q3257RGYRG4
SN74CB3Q3257DBQR
SN74CB3Q3257DGVR
SN74CB3Q3257PW
SN74CB3Q3257PWE4
SN74CB3Q3257PWG4
SN74CB3Q3257PWR
SN74CB3Q3257PWRE4
SN74CB3Q3257PWRG4
SN74CB3Q3257RGYR
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SSOP/
QSOP
SSOP/
QSOP
TVSOP
Package
Drawing
DBQ
DBQ
DGV
TVSOP
DGV
QFN
RGY
SSOP/
QSOP
TVSOP
DBQ
DGV
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
QFN
RGY
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1