SN74CB3Q3257_08 Datasheet, PDF (1/18 Pages) Texas Instruments – 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH

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SN74CB3Q3257
4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
SCDS135A – SEPTEMBER 2003 – REVISED MARCH 2005
FEATURES
• High-Bandwidth Data Path
(up to 500 MHz ⁽¹⁾)
• 5-V Tolerant I/Os With Device Powered Up or
Powered Down
• Low and Flat ON-State Resistance (r_on)
Characteristics Over Operating Range
(r_on = 4 Ω Typ)
• Rail-to-Rail Switching on Data I/O Ports
– 0- to 5-V Switching With 3.3-V V_CC
– 0- to 3.3-V Switching With 2.5-V V_CC
• Bidirectional Data Flow With Near-Zero
Propagation Delay
• Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(C_io(OFF) = 3.5 pF Typ)
• Fast Switching Frequency (f_OE = 20 MHz Max)
(1) For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application
report, CBT-C, CB3T, and CB3Q Signal-Switch Families,
literature number SCDA008.
• Data and Control Inputs Provide Undershoot
Clamp Diodes
• Low Power Consumption
(I_CC = 0.7 mA Typ)
• V_CC Operating Range From 2.3 V to 3.6 V
• Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
• Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
• Supports Both Digital and Analog
Applications: USB Interface, Differential
Signal Interface, Bus Isolation, Low-Distortion
Signal Gating
DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
S1
1B1 2
1B2 3
1A 4
2B1 5
2B2 6
2A 7
GND 8
16 V_CC
15 OE
14 4B1
13 4B2
12 4A
11 3B1
10 3B2
9 3A
1
1B1 2
1B2 3
1A 4
2B1 5
2B2 6
2A 7
8
16
15 OE
14 4B1
13 4B2
12 4A
11 3B1
10 3B2
9
DESCRIPTION/ORDERING INFORMATION
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
QFN – RGY
Tape and reel
SN74CB3Q3257RGYR
SSOP (QSOP) – DBQ
Tape and reel
SN74CB3Q3257DBQR
TSSOP – PW
Tape and reel
SN74CB3Q3257PWR
TVSOP – DGV
Tape and reel
SN74CB3Q3257DGVR
TOP-SIDE MARKING
BU257
BU257
BU257
BU257
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated