OPA192_15 Datasheet, PDF (7/52 Pages) Texas Instruments – OPAx192 36-V, Precision, Rail-to-Rail Input/Output, Low Offset Voltage,Low Input Bias Current Op Amp with e-trim™

www.ti.com
OPA192, OPA2192, OPA4192
SBOS620D – DECEMBER 2013 – REVISED SEPTEMBER 2015
6.4 Thermal Information: OPA192
THERMAL METRIC⁽¹⁾
D (SOIC)
OPA192
DBV (SOT)
DGK (VSSOP)
UNIT
8 PINS
5 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
115.8
60.1
56.4
12.8
55.9
N/A
158.8
60.7
44.8
1.6
4.2
N/A
180.4
67.9
102.1
10.4
100.3
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Thermal Information: OPA2192
THERMAL METRIC⁽¹⁾
OPA2192
D (SOIC)
DGK (VSSOP)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
107.9
53.9
48.9
6.6
48.3
N/A
158
°C/W
48.6
°C/W
78.7
°C/W
3.9
°C/W
77.3
°C/W
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.6 Thermal Information: OPA4192
THERMAL METRIC⁽¹⁾
OPA4192
D (SOIC)
PW (TSSOP)
UNIT
14 PINS
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
86.4
92.6
°C/W
46.3
27.5
°C/W
41.0
33.6
°C/W
11.3
1.9
°C/W
40.7
33.1
°C/W
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2013–2015, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: OPA192 OPA2192 OPA4192