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CDC339DBR Datasheet, PDF (7/13 Pages) Texas Instruments – CLOCK DRIVER WITH 3-STATE OUTPUTS
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jul-2011
PACKAGING INFORMATION
Orderable Device
CDC339DB
CDC339DBG4
CDC339DBG4
CDC339DBLE
CDC339DBLE
CDC339DW
CDC339DW
CDC339DWG4
CDC339DWG4
CDC339NSR
CDC339NSR
CDC339NSRG4
CDC339NSRG4
Status (1) Package Type Package
Drawing
ACTIVE
SSOP
DB
Pins
20
Package Qty
70
ACTIVE
SSOP
DB
20
70
ACTIVE
SSOP
DB
20
70
OBSOLETE SSOP
DB
20
OBSOLETE SSOP
DB
20
ACTIVE
SOIC
DW
20
25
ACTIVE
SOIC
DW
20
25
ACTIVE
SOIC
DW
20
25
ACTIVE
SOIC
DW
20
25
OBSOLETE
SO
OBSOLETE
SO
OBSOLETE
SO
OBSOLETE
SO
NS
20
NS
20
NS
20
NS
20
Eco Plan (2)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
TBD
TBD
TBD
Lead/
Ball Finish
MSL Peak Temp (3)
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(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1