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OPA314_15 Datasheet, PDF (6/45 Pages) Texas Instruments – OPAx314 3-MHz, Low-Power, Low-Noise, RRIO, 1.8-V CMOS Operational Amplifier
OPA314, OPA2314, OPA4314
SBOS563G – MAY 2011 – REVISED JUNE 2015
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted.(1)
Supply voltage
Signal input terminals
Output short-circuit(3)
Voltage (2)
Current (2)
Operating temperature, TA
Junction temperature, TJ
Storage temperature, Tstg
MIN
MAX
7
(V–) – 0.5 (V+) + 0.5
–10
10
Continuous
–40
150
–65
150
UNIT
V
V
mA
mA
°C
°C
°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
Machine model (MM)
VALUE
±4000
±1000
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VS
Supply voltage
TA
Ambient operating temperature
MIN
1.8 (±0.9)
–40
NOM
MAX
5.5 (±2.75)
125
UNIT
V
°C
6.4 Thermal Information: OPA314
THERMAL METRIC(1)
RθJA
RθJC(top)
RθJB
ψJT
ψJB
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
DBV (SOT23)
5 PINS
228.5
99.1
54.6
7.7
53.8
OPA314
DCK (SC70)
5 PINS
281.4
91.6
59.6
1.5
58.8
DRL (SOT553)
5 PINS
208.1
0.1
42.4
0.5
42.2
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
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