ADC10D1000QML-SP Datasheet, PDF (59/70 Pages) Texas Instruments – ADC10D1000QML Low Power, 10-Bit, Dual 1.0 GSPS or Single 2.0 GSPS A/D Converter

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ADC10D1000QML-SP
SNAS466F – FEBRUARY 2009 – REVISED APRIL 2013
ADC10D1000
I_E = I_F
100 pF
I_R
7
D1+
5
D-
FPGA
I_E = I_F
I_R
100 pF
6
D2+
LM95213
Figure 6-13. Typical Temperature Sensor Application
6.6.8 Radiation Environments
Careful consideration should be given to environmental conditions when using a product in a radiation
environment.
6.6.8.1 Total Ionizing Dose
Radiation hardness assured (RHA) products are those part numbers with a total ionizing dose (TID) level
specified in the Ordering Information table on the front page. Testing and qualification of these products is
done on a wafer level according to MIL-STD-883, Test Method 1019. Wafer level TID data is available
with lot shipments.
6.6.8.2 Single Event Latch-Up and Functional Interrupt
One time single event latch-up (SEL) and single event functional interrupt (SEFI) testing was preformed
according to EIA/JEDEC Standard, EIA/JEDEC57. The linear energy transfer threshold (LETth) shown in
the Key Specifications table on the front page is the maximum LET tested. A test report is available upon
request.
6.6.8.3 Single Event Upset
A report on single event upset (SEU) is available upon request.
6.6.9 Board Mounting Recommendation
Proper thermal profile is required to establish re-flow under the package and ensure all joints meet profile
specifications, See Table 6-13.
Table 6-13. Solder Profile Specification
Range Up °C/sec
Peak Temp (Tpk) °C
Max Peak Temp °C
Ramp down °C/sec
≤ 4°C/sec
210°C ≤Tpk ≤ 215°C
≤ 220°C
≤ 5°C/sec
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