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THS4532_15 Datasheet, PDF (5/58 Pages) Texas Instruments – THS4532 Ultra Low Power, Rail-to-Rail Output, Fully-Differential Amplifier
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THS4532
SLOS829A – FEBRUARY 2013 – REVISED JULY 2015
7 Specifications
7.1 Absolute Maximum Ratings(1)
MIN
MAX
UNIT
Supply voltage, VS– to VS+
Input/output voltage, VIN±, VOUT±, and VOCM pins
Differential input voltage, VID
Continuous output current, IO
Continuous input current, Ii
Continuous power dissipation
5.5
V
(VS–) – 0.7 (VS+) + 0.7
V
1
V
50
mA
0.75
mA
See Thermal Information
Maximum junction temperature, TJ
Operating junction temperature, TJ
Storage temperature, Tstg
150
°C
–40
125
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
VALUE
±2500
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VS+
Single-supply voltage
TA
Ambient temperature
MIN
NOM
MAX UNIT
2.7
5
5.4
V
–40
25
125
°C
7.4 Thermal Information
THERMAL METRIC (1)
THS4532
TSSOP (PW)
UNIT
16 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
122.4
61.2
66.7
14.4
66.2
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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