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| LP38852S-ADJ Datasheet, PDF (5/29 Pages) Texas Instruments – 1.5A Fast-Response High-Accuracy Adjustable LDO Linear Regulator with Enable and Soft-Start | |||
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LP38852
www.ti.com
SNVS482E â JANUARY 2007 â REVISED APRIL 2013
Electrical Characteristics (continued)
Unless otherwise specified: VOUT = 0.80V, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VEN = VBIAS, IOUT = 10 mA, CIN = COUT = 10 µF,
CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction
temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes
only.
Symbol
Parameter
Conditions
MIN
TYP
MAX
Units
AC Parameters
PSRR
Ripple Rejection for VIN Input
VIN = VOUT(NOM) + 1V, f = 120 Hz
-
80
-
(VIN)
Voltage
VIN = VOUT(NOM) + 1V, f = 1 kHz
-
65
-
dB
PSRR
(VBIAS)
Ripple Rejection for VBIAS Voltage
VBIAS = VOUT(NOM) + 3V, f = 120 Hz
VBIAS = VOUT(NOM) + 3V, f = 1 kHz
-
-
58
-
58
-
Output Noise Density
f = 120 Hz
-
1
-
µV/âHz
en
Output Noise Voltage
BW = 10 Hz â 100 kHz
BW = 300 Hz â 300 kHz
-
150
-
-
90
-
µVRMS
Thermal Parameters
TSD
TSD(HYS)
θJ-A
θJ-C
Thermal Shutdown Junction
Temperature
Thermal Shutdown Hysteresis
Thermal Resistance, Junction to
Ambient (5)
Thermal Resistance, Junction to
Case(5) (6)
TO-220-7
DDPAK-7
SO PowerPAD-8
TO-220-7
DDPAK-7
SO PowerPAD-8
-
160
-
°C
-
10
-
-
60
-
-
60
-
-
168
-
°C/W
-
3
-
-
3
-
-
11
-
(5) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to
ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See the Application Information section for details.
(6) For TO-220 and DDPAK: θJ-C refers to the BOTTOM surface of the package, under the epoxy body, as the 'CASE'. For SO PowerPAD-
8: θJ-C refers to the DAP (aka: Exposed Pad) on BOTTOM surface of the package as the 'CASE'.
Copyright © 2007â2013, Texas Instruments Incorporated
Product Folder Links: LP38852
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