English
Language : 

LP38851S-ADJ Datasheet, PDF (5/29 Pages) Texas Instruments – LP38851 800 mA Fast-Response High-Accuracy Adjustable LDO Linear Regulator with Enable and Soft-Start
◁
LP38851
www.ti.com
SNVS492C – JUNE 2007 – REVISED APRIL 2013
ELECTRICAL CHARACTERISTICS (continued)
Unless otherwise specified: VOUT = 0.80V, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VEN = VBIAS, IOUT = 10 mA, CIN = COUT = 10 µF,
CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction
temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes
only.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
PSRR
(VIN)
PSRR
(VBIAS)
Ripple Rejection for VIN Input
Voltage
Ripple Rejection for VBIAS Voltage
VIN = VOUT(NOM) + 1V,
f = 120 Hz
VIN = VOUT(NOM) + 1V,
f = 1 kHz
VBIAS = VOUT(NOM) + 3V,
f = 120 Hz
VBIAS = VOUT(NOM) + 3V,
f = 1 kHz
-
72
-
-
61
-
dB
-
54
-
-
53
-
Output Noise Density
f = 120 Hz
-
1
-
µV/√Hz
en
Output Noise Voltage
BW = 10 Hz − 100 kHz
BW = 300 Hz − 300 kHz
-
150
-
-
90
-
µVRMS
Thermal Parameters
TSD
TSD(HYS)
θJ-A
Thermal Shutdown Junction
Temperature
Thermal Shutdown Hysteresis
Thermal Resistance, Junction to
Ambient (5)
θJ-C
Thermal Resistance, Junction to
Case(5) (6)
SFM
PFM
SO PowerPad
SFM
PFM
SO PowerPad
-
160
-
°C
-
10
-
-
60
-
-
60
-
-
168
-
°C/W
-
3
-
-
3
-
-
11
-
(5) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to
ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See APPLICATION INFORMATION for details.
(6) For SFM and PFM: θJ-C refers to the BOTTOM surface of the package, under the epoxy body, as the 'CASE'. For SO PowerPad: θJ-C
refers to the DAP (aka: Exposed Pad) on BOTTOM surface of the package as the 'CASE'.
Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LP38851
Submit Documentation Feedback
5
 ▷