LP2951-N_15_15 Datasheet, PDF (5/50 Pages) Texas Instruments – LP295x-N Series of Adjustable Micropower Voltage Regulators

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LP2950-N, LP2951-N
SNVS764O – JANUARY 2000 – REVISED DECEMBER 2014
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Maximum input supply voltage
Junction temperature (T_J)⁽²⁾
LP2950AC-XX, LP2950C-XX
LP2951
LP2951AC-XX, LP2951C-XX
MIN
MAX UNIT
30 V
–40
125 °C
–55
150 °C
–40
125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The junction-to-ambient thermal resistances are as follows: 157.4°C/W for the TO-92(LP) package, 51.3°C/W for the TO-252 (NDP)
package, 56.3°C/W for the molded PDIP (P), 117.7°C/W for the molded plastic SOIC (D), 171°C/W for the molded plastic VSSOP
(DGK). The above thermal resistances for the P, D, and DGK packages apply when the package is soldered directly to the PCB. The
value of R^θJA for the WSON (NGT) package is typically 43.3°C/W but is dependent on the PCB trace area, trace material, and the
number of layers and thermal vias. For details of thermal resistance and power dissipation for the WSON package, refer to Texas
Instruments Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).
7.4 Thermal Information: LP2950-N
THERMAL METRIC⁽¹⁾
LP2950-N
LP
NDP
UNIT
3 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
157.4
81.2
153.6
25.2
n/a
n/a
51.3
53.5
30.4
°C/W
5.5
30
2.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Thermal Information: LP2951-N
THERMAL METRIC⁽¹⁾
LP2951-N
P
D
DGK
NGT
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
56.3
117.7
171.0
45.7
63.7
62.3
33.5
57.9
91.4
22.9
15.9
8.9
33.3
57.5
90.1
n/a
n/a
n/a
43.3
35.0
23.3
°C/W
0.5
20.5
9.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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