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DRV8846_15 Datasheet, PDF (5/35 Pages) Texas Instruments – DRV8846 Dual H-Bridge Stepper Motor Driver
www.ti.com
DRV8846
SLLSEK2 – JUNE 2014
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature referenced with respect to GND (unless otherwise noted)(1)
Power supply voltage (VM)
Power supply voltage ramp rate (VM)
Internal regulator voltage (VINT)
Analog input pin voltage (VREF)
Control pin voltage (nENABLE, STEP, DIR, I0, I1, M0, M1, DEC0, DEC1, TOFF_SEL, nSLEEP,
nFAULT, ADEC)
Continuous phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2)
Continuous shunt amplifier input pin voltage (AISEN, BISEN)(2)
Peak drive current (AOUT1, AOUT2, BOUT1, BOUT2, AISEN, BISEN)
TJ
Operating junction temperature
MIN
MAX
–0.3
20
0
2
–0.3
3.6
–0.3
3.6
–0.3
7.0
–0.3 VM + 0.6
–0.6
0.6
Internally limited
–40
150
UNIT
V
V/µs
V
V
V
V
V
A
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Transients of ±1 V for less than 25 ns are acceptable.
7.2 Handling Ratings
MIN
Tstg
V(ESD)
Storage temperature range
Electrostatic Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
discharge
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
–65
–4
–1.5
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
MAX
150
4
1.5
UNIT
°C
kV
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VM
Power supply voltage range(1)
4
VREF
Reference rms voltage range(2)
1
ƒPWM
Applied STEP signal
0
IVINT
VINT external load current
Irms
Motor rms current per H-bridge(3)
0
TA
Operating ambient temperature
–40
(1) Note that RDS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V
(2) Operational at VREF between 0 to 1 V, but accuracy is degraded
(3) Power dissipation and thermal limits must be observed
MAX
18
3.3
250
1
1
85
UNIT
V
V
kHz
mA
A
°C
7.4 Thermal Information
THERMAL METRIC(1)
DRV8846
QFN
UNIT
24 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
34
36.9
12.5
°C/W
0.4
12.5
2.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2014, Texas Instruments Incorporated
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