DRV8834 Datasheet, PDF (5/30 Pages) Texas Instruments – DUAL BRIDGE STEPPER OR DC MOTOR DRIVER

DRV8834
www.ti.com
SLVSB19A – FEBRUARY 2012 – REVISED MARCH 2012
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) ^{(1) (2)}
VALUE
UNIT
VM
Power supply voltage range
–0.3 to 11.8
V
AVREF,
BVREF,
VINT,
ADECAY,
BDECAY
Analog input pin voltage range
-0.5 to 3.6
V
Digital input pin voltage range
–0.5 to 7
V
xISEN pin voltage
–0.3 to 0.5
V
Peak motor drive output current, t < 1 µs
Internally limited
A
T_J
Operating virtual junction temperature range
T_stg
Storage temperature range
–40 to 150
°C
–60 to 150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
THERMAL METRIC
Junction-to-ambient thermal resistance⁽¹⁾
Junction-to-case (top) thermal resistance⁽²⁾
Junction-to-board thermal resistance⁽³⁾
Junction-to-top characterization parameter⁽⁴⁾
Junction-to-board characterization parameter⁽⁵⁾
Junction-to-case (bottom) thermal resistance⁽⁶⁾
PWP
24 PINS
40.2
23.7
21.9
0.7
21.7
3.9
RGE
24 PINS
35.1
36.6
12.2
0.6
12.2
4.0
UNITS
°C/W
xxx
(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(4) The junction-to-top characterization parameter, ψ_JT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).
(5) The junction-to-board characterization parameter, ψ_JB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA , using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
RECOMMENDED OPERATING CONDITIONS
T_A = 25°C, over operating free-air temperature range (unless otherwise noted)
MIN
V_M
Motor power supply voltage range⁽¹⁾
2.5
V_REF
VREF input voltage range⁽²⁾
1
I_VINT
VINT external load current
I_VREF
VREF external load current
V_DIGIN
Digital input pin voltage range
-0.3
I_OUT
Continuous RMS or DC output current per bridge⁽³⁾
NOM
(1) Note that R_DS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V.
(2) Operational at VREF between 0 V and 1 V, but accuracy is degraded.
(3) Power dissipation and thermal limits must be observed.
MAX
10.8
2
1
400
5.75
1.5
UNIT
V
V
mA
µA
V
A
Copyright © 2012, Texas Instruments Incorporated
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