DRV8823-Q1_15 Datasheet, PDF (5/22 Pages) Texas Instruments – 4-BRIDGE SERIAL INTERFACE MOTOR DRIVER

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DRV8823-Q1
SLVSBH2B – JUNE 2012 – REVISED JANUARY 2013
DISSIPATION RATINGS
BOARD
Low-K ⁽¹⁾
Low-K ⁽²⁾
High-K ⁽³⁾
High-K ⁽⁴⁾
PACKAGE
DCA
R_θJA
75.7°C/W
32°C/W
30.3°C/W
22.3°C/W
DERATING FACTOR
ABOVE T_A = 25°C
13.2 mW/°C
31.3 mW/°C
33 mW/°C
44.8 mW/°C
T_A < 25°C
1.65 W
3.91 W
4.13 W
5.61 W
T_A = 70°C
1.06 W
2.50 W
2.48 W
3.59 W
T_A = 85°C
0.86 W
2.03 W
2.15 W
2.91 W
T_A = 125°C
0.332 W
0.778 W
0.83 W
1.118 W
(1) The JEDEC Low-K board used to derive this data was a 76-mm x 114-mm, 2-layer, 1.6-mm thick PCB with no backside copper.
(2) The JEDEC Low-K board used to derive this data was a 76-mm x 114-mm, 2-layer, 1.6-mm thick PCB with 25-cm² 2-oz copper on back
side.
(3) The JEDEC High-K board used to derive this data was a 76-mm x 114-mm, 4-layer, 1.6-mm thick PCB with no backside copper and
solid 1-oz internal ground plane.
(4) The JEDEC High-K board used to derive this data was a 76-mm x 114-mm, 4-layer, 1.6-mm thick PCB with 25-cm² 1-oz copper on back
side and solid 1-oz internal ground plane.
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