CC3000MOD Datasheet, PDF (5/16 Pages) Texas Instruments – TI SimpleLink CC3000 Module . Wi-Fi 802.11b/g Network Processor

CC3000MOD
www.ti.com
SWRS126 – NOVEMBER 2012
ESD PERFORMANCE
Because electrostatic discharge (ESD) can damage this integrated circuit, TI recommends handling all integrated
circuits (ICs) with appropriate precautions. Failure to observe proper handling and installation procedures can
cause damage. ESD damage can range from subtle performance degradation to complete device failure.
Precision ICs can be more susceptible to damage because very small parametric changes can cause devices
not to meet their published specifications.
Table 2 describes the ESD performance.
HDM ⁽¹⁾
1000 V
(1) JEDEC ESD HBM spec JS-001-2012
(2) JEDEC ESD CDM spec 22C101E
space
MODULE SPECIFICATIONS
Table 2. ESD Performance
CDM ⁽²⁾
500 V
Absolute Maximum Ratings
Parameters
Pin
Min
Max
Unit
VBAT_IN
19
–0.5
+6.0
V
VIO_HOST
23
–0.5
+4.6
V
I2C and WL_RS232
27, 28, 29, 30, 6, 8
–0.5
+2.1
V
SPI interface
12, 13, 14, 15, 17
–0.5
+4.6
V
VBAT_SW_EN
26
–0.3
+6.0
V
Storage temperature range
–
–40
+85
°C
Recommended Operating Conditions
Rating
Condition
Operating ambient
temperature
VBAT_IN
VIO_HOST supply voltage
SPI interface
High-level input voltage VIO_HOST =
1.8 to 1.95 V
1.95 to 2.7 V
2.7 to 3.6 V
Low-level input voltage VIO_HOST =
1.8 to 1.95 V
1.95 to 2.7 V
2.7 to 3.6 V
Input voltage
Output voltage
Active state
Input transition rise or fall
rate
VBAT SW EN
High-level input voltage
Low-level input voltage
Sym
VIH
VIL
VI
VO
△t/△v
Min
Max
–20
+70
2.7
4.8
1.8
3.6
VIO_HOST x 0.65
1.6
2
0
0
VIO_HOST × 0.35
0.7
0.8
3.6
VIO_HOST
5
Unit
°C
V
V
V
V
V
V
ns/V
VIH
1.1
VIL
0
5.5
V
0.4
V
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
5