AMC1304L05_15 Datasheet, PDF (5/39 Pages) Texas Instruments – AMC1304x High-Precision,Reinforced Isolated Delta-Sigma Modulators with LDO

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AMC1304L05, AMC1304L25, AMC1304M05, AMC1304M25
SBAS655C – SEPTEMBER 2014 – REVISED SEPTEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over the operating ambient temperature range (unless otherwise noted)⁽¹⁾
PARAMETER
MIN
Supply voltage
DVDD to DGND
–0.3
LDO input voltage
LDOIN to AGND
–0.3
Analog input voltage at AINP, AINN
AGND – 6
Digital input voltage at CLKIN, CLKIN_N
DGND – 0.3
Input current to any pin except supply pins
–10
Temperature
Maximum virtual junction, T_J
Storage, T_stg
–65
MAX
6.5
26
3.7
DVDD + 0.3
10
150
150
UNIT
V
V
V
V
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101 ⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
T_A
Operating ambient temperature range
–40
LDOIN
LDO input supply voltage (LDOIN pin)
4.0
DVDD
Digital (controller-side) supply voltage (DVDD pin)
3.0
NOM
15.0
3.3
MAX
125
18.0
5.5
UNIT
°C
V
V
7.4 Thermal Information
THERMAL METRIC ⁽¹⁾
AMC1304x
DW (SOIC)
UNIT
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
80.2
°C/W
40.5
°C/W
45.1
°C/W
11.9
°C/W
44.5
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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