SN74V263 Datasheet, PDF (48/52 Pages) Texas Instruments – 8192 × 18, 16384 × 18, 32768 × 18, 65536 × 18 3.3-V CMOS FIRST-IN, FIRST-OUT MEMORIES

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PACKAGE OPTION ADDENDUM
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
SN74V263-10GGM
SN74V263-10PZA
SN74V263-15GGM
SN74V263-15PZA
SN74V263-6GGM
SN74V263-6PZA
SN74V263-7GGM
SN74V263-7PZA
SN74V273-10GGM
SN74V273-10PZA
SN74V273-15GGM
SN74V273-15PZA
SN74V273-6GGM
SN74V273-6PZA
SN74V273-7GGM
SN74V273-7PZA
SN74V283-10GGM
SN74V283-10PZA
SN74V283-15GGM
SN74V283-15PZA
SN74V283-6GGM
SN74V283-6PZA
SN74V283-7GGM
SN74V283-7PZA
SN74V293-10GGM
SN74V293-10PZA
SN74V293-15GGM
SN74V293-15PZA
SN74V293-6GGM
SN74V293-6PZA
SN74V293-7GGM
SN74V293-7PZA
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
BGA
LQFP
Package
Drawing
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
GGM
PZA
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
100 184
None
Call TI
Level-3-220C-168 HR
80 90
None
Call TI
Level-3-220C-168 HR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
Addendum-Page 1