MSP430F1122 Datasheet, PDF (42/48 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430x11x2, MSP430x12x2
MIXED SIGNAL MICROCONTROLLER
SLAS361C − JANUARY 2002 − REVISED DECEMBER 2003
RHB (S−PQFP−N32)
A
5,00
B
PLASTIC QUAD FLATPACK
5,00 _{3ÇÇÇÇÇ2 ÇÇÇÇÇ1ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ}
PIN 1
INDEX AREA
1,00
0,80
0,08 C
0,20 REF
C
SEATING PLANE
0,05 MAX
PIN 1
IDENTIFIER
3,25
3,00 ^SQ
1
0,23
32
0,18
0,23
0,50
32X _0,30
4X ^3,50
0,18
EXPOSED THERMAL
DIE PAD
D
0,50
0,30
32X _0,18
0,10 ^M C A B
4204326/A 04/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. QFN (Quad Flatpack No−Lead) Package configuration.
D. The Package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane. This pad is
electrically and thermally connected to the backside of the die and possibly selected ground leads.
E. Falls within JEDEC MO−220.
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