TLC274IDR Datasheet, PDF (4/53 Pages) Texas Instruments – The TLC274 and TLC279 quad operational amplifiers combine a wide range of input offset voltage grades with low offset voltage drift, high...

TLC274, TLC274A, TLC274B, TLC274Y, TLC279
LinCMOS PRECISION QUAD OPERATIONAL AMPLIFIERS
SLOS092D − SEPTEMBER 1987 − REVISED MARCH 2001
TLC274Y chip information
These chips, when properly assembled, display characteristics similar to the TLC274C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(14)
(13)
(12) ⁽¹¹⁾ (10)
(9)
68
(1)
(2)
(3) _{(4) (5)}
(6)
108
VDD
(8)
(4)
(3)
1IN +
+
(1)
(2)
1OUT
1IN −
−
(7)
2OUT
(10)
3IN +
+
(9)
3IN −
−
+ ⁽⁵⁾
(6)
−
(8)
2IN +
2IN −
3OUT
(14)
4OUT
+ ⁽¹²⁾
(13)
−
4IN +
4IN −
11
(7)
GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACK SIDE OF CHIP.
4
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