TLC2274-HT Datasheet, PDF (4/29 Pages) Texas Instruments – TLC2274-HT Advanced LinCMOS Rail-to-Rail Operational Amplifier

TLC2274-HT
SGLS416 – JANUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_DD+
V_DD–
V_ID
V_I
I_I
I_O
T_A
T_stg
Supply voltage⁽²⁾
Supply voltage⁽²⁾
Differential input voltage⁽³⁾
Input voltage⁽²⁾
Any input
Input current
Any input
Output current
Total current into V_DD+
Total current out of V_DD−
Duration of short-circuit current at (or below) 25°C⁽⁴⁾
Operating free-air temperature
Lead temperature 1.6 mm (1/16 inch) from case for 10 s
Storage temperature
MIN
MAX
8
–8
–16
16
V_DD– – 0.3
–5
V_DD+
5
–50
50
–50
50
–50
50
Unlimited
–40
150
260
–65
150
UNIT
V
V
V
V
mA
mA
mA
mA
°C
°C
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the midpoint between V_DD+ and V_DD–.
(3) Differential voltages are at I_N+ with respect to I_N–. Excessive current will flow if input is brought below V_DD– – 0.3 V.
(4) The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation
rating is not exceeded.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
All pins
VALUE
±2500
±1500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_DD±
V_I
V_IC
T_A
Supply voltage
Input voltage
Common-mode input voltage
Operating free-air temperature
MIN
±2.2
V_DD−
V_DD−
−40
MAX
±8
V_DD+ −1.5
V_DD+ −1.5
150
UNIT
V
V
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TLC2274
PW
UNIT
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
106.0
35.5
47.6
2.4
47.1
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Submit Documentation Feedback
Product Folder Links: TLC2274-HT
Copyright © 2015, Texas Instruments Incorporated