TLC1078CDRG4 Datasheet, PDF (4/36 Pages) Texas Instruments – LinCMOS UPOWER PRECISION OPERATIONAL AMPLIFIERS

TLC1078, TLC1078Y, TLC1079, TLC1079Y
LinCMOS µPOWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS179A – FEBRUARY 1997 – REVISED MARCH 2001
TLC1079Y chip information
This chip, when properly assembled, display characteristics similar to the TLC1079C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(1)
(2)
(3)
130 (4)
(5)
(14)
(13)
(12)
(11)
(10)
(3)
1IN +
(2)
1IN –
(5)
2IN +
(6)
2IN –
VDD
(4)
+
–
+
–
(1)
1OUT
(7)
2OUT
3IN +
3IN –
(10)
+
(9)
–
(8)
3OUT
(12)
4IN +
+
(13)
4IN –
–
(14)
4OUT
(11)
VDD_– /GND
(6)
(7)
70
(9)
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
(8)
TO BACKSIDE OF CHIP.
4
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