TLC1078CDRG4 Datasheet, PDF (3/36 Pages) Texas Instruments – LinCMOS UPOWER PRECISION OPERATIONAL AMPLIFIERS

TLC1078, TLC1078Y, TLC1079, TLC1079Y
LinCMOS µPOWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS179A – FEBRUARY 1997 – REVISED MARCH 2001
TLC1087Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC1078C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(1)
(8)
BONDING PAD ASSIGNMENTS
83
(7)
VDD
(8)
1IN + ⁽³⁾ ₊
(2)
1IN –
–
1OUT
2IN +
2IN –
(5)
+
(6)
–
(4)
VDD _– /GND
2OUT
(2)
(6)
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
(3)
TOLERANCES ARE ± 10%.
(4)
(5)
ALL DIMENSIONS ARE IN MILS.
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