OPA348-Q1 Datasheet, PDF (4/30 Pages) Texas Instruments – OPAx348-Q1 1-MHz 45-μA CMOS Rail-to-Rail Operational Amplifier

OPA348-Q1, OPA2348-Q1, OPA4348-Q1
SBOS465B – JANUARY 2009 – REVISED DECEMBER 2014
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage, V_S
Input voltage, V_IN
Input current, I_IN
Output short-circuit duration⁽³⁾
Operating free-air temperature, T_A
Operating virtual-junction temperature, T_J
Storage temperature, T_stg
V– to V+
Signal input terminals⁽²⁾
Signal input terminals⁽²⁾
MIN
MAX
7.5
(V–) – 0.5 V (V+) + 0.5 V
10
Continuous
–40
150
150
–65
150
UNIT
V
V
mA
°C
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current-limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC ^{All pins}
Q100-011
Corner pins (1, 7, 8, 14)
VALUE
±2000
±500
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_S
Supply voltage, V– to V+
T_A
Operating free-air temperature
MIN
MAX UNIT
2.1
5.5
V
–40
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
OPA348-Q1
DBV (SOT-23)
5 PINS
228.5
99.1
54.6
7.7
53.8
OPA2348-Q1
D (SOIC)
8 PINS
138.4
89.5
78.6
29.9
78.1
OPA4348-Q1
PW (TSSOP)
14 PINS
121
49.4
62.8
5.9
62.2
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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