OPA2277-EP Datasheet, PDF (4/21 Pages) Texas Instruments – OPA2277-EP High-Precision, Low-Noise Operational Amplifier

OPA2277-EP
SBOS700 – DECEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature (unless otherwise noted)
Supply voltage
Input voltage
Output short-circuit (to ground)⁽²⁾
Operating temperature
Junction temperature
Lead temperature (soldering, 10 s)
T_stg Storage temperature range
MIN
MAX
36
(V–) – 0.7
(V+) + 0.7
Continuous
–55
125
150
300
–55
125
UNIT
V
V
°C
°C
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) One channel per package.
7.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Machine model (MM)
VALUE
±2000
±100
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_S
Specified voltage range
Operating voltage range
T_J
Operating junction temperature
MIN NOM MAX UNIT
±5
±15 V
±2
±18 V
–55
125 °C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA2277
D
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
91.9
39.9
40.6
°C/W
3.9
39.6
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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