LP3872_15 Datasheet, PDF (4/28 Pages) Texas Instruments – LP387x 1.5-A Fast Ultra-Low-Dropout Linear Regulators

LP3872, LP3875
SNVS227H – FEBRUARY 2003 – REVISED JANUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾⁽²⁾
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability
and specifications.
MIN
MAX
UNIT
Lead temperature (soldering, 5 sec.)
Power dissipation⁽³⁾
260
°C
Internally limited
IN pin to GND pin voltage
−0.3
7.5
V
Shutdown (SD) pin to GND pin voltage
OUT pin to GND pin voltage⁽⁴⁾, ⁽⁵⁾
−0.3
7.5
V
−0.3
6
V
I_OUT
ERROR pin to GND pin voltage
SENSE pin to GND pin voltage
Storage temperature, T_stg
Short-circuit protected
V_IN
V
V_OUT
V
−65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings⁽¹⁾⁽²⁾ may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Internal thermal shutdown circuitry protects the device from permanent damage.
(4) If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground.
(5) The output PMOS structure contains a diode between the IN and OUT pins. This diode is normally reverse biased. This diode will get
forward biased if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically
withstand 200 mA of DC current and 1 A of peak current.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
VALUE
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
V_IN supply voltage ⁽¹⁾
Shutdown (SD) voltage
MIN
2.5
−0.3
Maximum operating current (DC) I_OUT
Junction temperature
–40
(1) The minimum operating value for V_IN is equal to either [V_OUT(NOM) + V_DROPOUT] or 2.5 V, whichever is greater.
MAX
7
7
1.5
125
UNIT
V
V
A
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LP3872, LP3875
LP3875
NDC (SOT-223) KTT (TO-263) NDH (TO-220)
UNIT
5 PINS
5 PINS
5 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
65.2
40.3
32
47.2
43.4
43.8
9.9
23.1
18.6
°C/W
3.4
11.5
8.8
9.7
22
18
n/a
1
1.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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