LMH6642Q-Q1_15 Datasheet, PDF (4/34 Pages) Texas Instruments – Low Power, 130 MHz, 75 mA Rail-to-Rail Output Amplifiers

LMH6642Q-Q1, LMH6643Q-Q1
SNOSC61C – JANUARY 2012 – REVISED SEPTEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings^(1)(2)(1)
over operating free-air temperature range (unless otherwise noted)
V_IN Differential
Output Short Circuit Duration
Supply Voltage (V⁺ - V^−)
Voltage at Input/Output pins
Input Current
Junction Temperature ⁽⁵⁾
Soldering Information
Infrared or Convection Reflow (20 sec)
Wave Soldering Lead Temp.(10 sec)
MIN
MAX
UNIT
±2.5
V
See ⁽³⁾ and ⁽⁴⁾
13.5
V
V⁺ +0.8
V^− −0.8
V
±10
mA
+150
°C
235
°C
260
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4) Output short circuit duration is infinite for V_S < 6 V at room temperature and below. For V_S > 6 V, allowable short circuit duration is
1.5ms.
(5) The maximum power dissipation is a function of T_J(MAX),R _θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/R _θJA. All numbers apply for packages soldered directly onto a PC board.
7.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic discharge
Human body model (HBM), per AEC Q100-002⁽¹⁾
Machine Model (MM)⁽²⁾
Charged Device Model (CDM), per AEC Q100-011
MIN
MAX
UNIT
−65
+150
°C
2000
200
V
1000
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification,1.5kΩ in series with
100pF.
(2) Machine Model, 0Ω in series with 200pF.
7.3 Recommended Operating Conditions⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply Voltage (V⁺ – V^−)
Operating Temperature Range⁽²⁾
MIN
MAX UNIT
2.7
10
V
−40
+85
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T_J(MAX),R_θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/R_θJA. All numbers apply for packages soldered directly onto a PC board.
7.4 Thermal Information
R_θJA
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance⁽²⁾
DBV05A
5 PINS
265°C/W
DGK08A
8 PINS
235°C/W
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of T_J(MAX),R_θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/R_θJA. All numbers apply for packages soldered directly onto a PC board.
4
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