LMH3401 Datasheet, PDF (4/48 Pages) Texas Instruments – LMH3401 7-GHz, Ultra-Wideband, Fixed-Gain, Fully-Differential Amplifier

LMH3401
SBOS695A – AUGUST 2014 – REVISED DECEMBER 2014
7 Specifications
www.ti.com
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Voltage
Power supply
Input voltage range
Current
Input current, IN+, IN–
Output current (sourcing or sinking) OUT+, OUT–
Continuous power dissipation
Temperature
Maximum junction temperature, T_J
Maximum junction temperature, continuous operation, long-term
reliability
Operating free-air, T_A
Storage, T_stg
MIN
MAX
UNIT
5.5
V
VS– – 0.7 VS+ + 0.7
V
10
mA
100
mA
See Thermal Information
150
°C
125
°C
–40
85
°C
–40
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2500
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (V_S = VS+ – VS–)
Operating junction temperature, T_J
Ambient operating air temperature, T_A
MIN
NOM
MAX UNIT
3.15
5
5.25
V
–40
125
°C
–40
25
85
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMH3401
RMS (UQFN)
UNIT
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
101
51
61
°C/W
4.2
61
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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