LM3668_15 Datasheet, PDF (4/30 Pages) Texas Instruments – 1-A, High-Efficiency Dual-Mode Single-Inductor Buck-Boost DC-DC Converter

LM3668
SNVS449O – JUNE 2007 – REVISED APRIL 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
PVIN, VDD, SW1, SW2 & VOUT pins: voltage to SGND & PGND
FB, EN, and MODE/SYNC pins
PGND to SGND
Continuous power dissipation⁽³⁾
Maximum junction temperature (T_J-MAX)
Maximum lead temperature (soldering, 10 sec)
Storage temperature , T_stg
MIN
–0.2
(PGND and SGND-0.2)
–0.2
Internally Limited
–65
MAX
6
(PV_IN + 0.2)
0.2
125
260
150
UNIT
V
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125ºC), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (R_θJA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (R_θJA × P_D-MAX).
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2500
±1250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
MIN
MAX UNIT
Input voltage
2.5
5.5
V
Recommended load current
0
1
A
Junction temperature (T_J)
Ambient temperature (T_A) ⁽¹⁾
−40
125
°C
−40
85
°C
(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125ºC), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (R_θJA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (R_θJA × P_D-MAX).
4
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