DAC8812_15 Datasheet, PDF (4/29 Pages) Texas Instruments – DAC8812 Dual, Serial-Input 16-Bit Multiplying Digital-to-Analog Converter

DAC8812
SBAS349C – AUGUST 2005 – REVISED NOVEMBER 2015
7 Specifications
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7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)⁽¹⁾
MIN
V_DD to GND
V_REFx, R_FBx to GND
Digital logic inputs to GND
–0.3
–18
–0.3
I_OUTx to GND
A_GNDx to DGND
Input current to any pin except supplies
–0.3
–0.3
–50
Package power dissipation
Maximum junction temperature (T_Jmax)
Operating temperature range
–40
Storage temperature, T_stg
–65
MAX
7
18
V_DD + 0.3
V_DD + 0.3
0.3
50
(150°C – T_A) /
R_θJA
150
85
150
UNIT
V
V
V
V
V
mA
W
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±4000
±1000
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±4000
V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±1000
V may actually have higher performance.
7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
V_DD
Supply voltage to GND
T_A
Operating ambient temperature
MIN
NOM
MAX UNIT
2.7
5.5
V
–40
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
DAC8812
PW (TSSOP)
UNIT
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
100.6
32.8
46.8
2
46
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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