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CD74HCT4543 Datasheet, PDF (4/10 Pages) Texas Instruments – BCD-TO-7 SEGMENT LATCH/DECODER/DRIVER
CD74HCT4543
BCD-TO-7 SEGMENT LATCH/DECODER/DRIVER
SCHS281A – REVISED MAY 2003
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input diode current, IIK (VI < –0.5 V or VI > VCC + 0.5 V) ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output diode current, IOK (VO < –0.5 V or VO > VCC + 0.5V) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output source or sink current per output, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum . . . . . . . . . . . . . . . . . . . . . 265°C
Unit inserted into a PC board (min. thickness 1/16 in., 1.59 mm)
with solder contacting lead tips only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
TA = 25°C
MIN MAX
TA = –55°C
TO 125°C
MIN MAX
TA = –40°C
TO 85°C
MIN MAX
UNIT
VCC Supply voltage
4.5 5.5 4.5 5.5 4.5 5.5 V
VIH High-level input voltage
2
2
2
V
VIL Low-level input voltage
0.8
0.8
0.8 V
VI Input voltage
VCC
VCC
VCC V
VO Output voltage
VCC
VCC
VCC V
tt
Input transition (rise and fall) time
500
500
500 ns
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C
MIN TYP MAX
TA = –55°C
TO 125°C
MIN MAX
TA = –40°C
TO 85°C
MIN MAX
UNIT
VOH
VI = VIH or VIL
IOH = –20 µA
IOH = –4 mA
4.5 V
4.4
3.98
VOL
VI = VIH or VIL
IOL = 20 µA
IOL = 4 mA
4.5 V
II
VI = VCC to GND
5.5 V
ICC
VI = VCC or 0,
IO = 0
5.5 V
4.4
4.4
V
3.7
3.84
0.1
0.1
0.1
V
0.26
0.4
0.33
±0.1
±1
±1 µA
8
160
80 µA
∆ICC‡
One input at VCC – 2.1 V,
Other inputs at 0 or VCC
4.5 V to 5.5 V
100 360
490
450 µA
Ci
10
10
10 pF
‡ Additional quiescent supply current per input pin, TTL inputs high, 1 unit load. For dual-supply systems, theoretical worst-case
(VI = 2.4 V, VCC = 5.5 V) specification is 1.8 mA.
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