BQ25101H_15 Datasheet, PDF (4/32 Pages) Texas Instruments – bq2510x 250-mA Single Cell Li-Ion Battery Chargers, 1-mA Termination, 75-nA Battery Leakage

bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L
SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
IN (with respect to VSS)
Input voltage
OUT (with respect to VSS)
PRE-TERM, ISET, TS, CHG
(with respect to VSS)
Input current
IN
Output current (continuous) OUT
Output sink current
CHG
T_J
Junction temperature
MIN
MAX UNIT
–0.3
30
V
–0.3
7
V
–0.3
7
V
300
mA
300
mA
15
mA
–40
150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
7.2 Handling Ratings
MIN
MAX UNIT
ESD
Electrostatic discharge
(IEC61000-4-2) ⁽¹⁾
IN, OUT, TS
1 µF between IN and GND,
1 µF between TS and GND,
2 µF between OUT and GND,
x5R Ceramic or equivalent
8
kV
contact
15 Air
T_STG Storage temperature
–65
150
°C
(1) The test was performed on IC pins that may potentially be exposed to the customer at the product level. The bq2510x IC requires a
minimum of the listed capacitance, external to the IC, to pass the ESD test.
7.3 Recommended Operating Conditions ⁽¹⁾
V_IN
I_IN
I_OUT
T_J
R_PRE-TERM
R_ISET
R_TS
IN voltage range
IN operating voltage range, Restricted by V_DPM and V_OVP
Input current, IN pin
Current, OUT pin
Junction temperature
Programs precharge and termination current thresholds
Fast-charge current programming resistor
10k NTC thermistor range without entering BAT_EN or TTDM
(1) Operation with V_IN less than 4.5V or in drop-out may result in reduced performance.
MIN NOM UNIT
3.5
28 V
4.45 6.45 V
250 mA
250 mA
0
125 °C
0.6
30 kΩ
0.54 13.5 kΩ
1.66
258 kΩ
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq25100
YFP (6 PINS)
UNIT
R_θJA
R_θJCtop
R_θJB
ψ_JT
ψ_JB
R_θJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
132.9
1.3
21.8
5.6
21.8
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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