AMC1203 Datasheet, PDF (4/23 Pages) Texas Instruments – 1-Bit, 10MHz, 2nd-Order, Isolated Delta-Sigma Modulator

AMC1203
SBAS427 – FEBRUARY 2008
www.ti.com
PACKAGE CHARACTERISTICS⁽¹⁾
Over recommended operating conditions, unless otherwise noted.
PARAMETER
L(I01) Minimum air gap (clearance)
L(I02) Minimum external tracking (creepage)
CTI
Tracking resistance (comparative
tracking index)
Minimum internal gap (internal
clearance)
R_IO Isolation resistance
C_IO Barrier capacitance input to output
C_I
Input capacitance to ground
TEST CONDITIONS
Shortest terminal to terminal distance
through air
Shortest terminal to terminal distance
across the package surface
DIN IEC 60112 / VDE 0303 Part 1
Distance through the insulation
Input to output, V_IO = 500V, all pins on
each side of the barrier tied together
creating a two-terminal device, T_A < +85°C
Input to output, V_IO = 500V,
+100°C ≤ T_A < T_A max
V_I = 0.8V_PP at 1MHz
V_I = 0.8V_PP at 1MHz
MIN
TYP
7.0
7.0
≥ 175
0.008
> 10¹²
> 10¹¹
1.2
3
MAX
UNIT
mm
mm
V
mm
Ω
Ω
pF
pF
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care
should be taken to maintain the creepage and clearance distance of the board design to ensure that the mounting pads of the isolator
on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to
the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit
board are used to help increase these specifications.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A
failure of the I/O circuitry can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient
power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings
table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware
determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is
that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction
temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.
PARAMETER
I_S Safety input, output, or supply current
T_C Maximum case temperature
TEST CONDITIONS
θ_JA = 246°C/W, V_I = 5.5V, T_J = +150°C, T_A = +25°C
MIN TYP
MAX
90
+150
UNIT
mA
°C
IEC 61000-4-5 RATINGS
PARAMETER
Surge immunity
TEST CONDITIONS
1.2/50µs voltage surge and 8/20µs current surge
VALUE
±6000
UNIT
V
IEC 60664-1 RATINGS
PARAMETER
Basic isolation group
Installation classification
TEST CONDITIONS
Material group
Rated mains voltage ≤ 150 V_RMS
Rated mains voltage < 300 V_RMS
SPECIFICATION
IIIa
I-IV
I-III
4
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