TM124BBJ32F Datasheet, PDF (3/10 Pages) Texas Instruments – 32-BIT DYNAMIC RAM MODULE

TM124BBJ32F, TM124BBJ32U 1048576 BY 32-BIT DYNAMIC RAM MODULE
TM248CBJ32F, TM248CBJ32U 2097152 BY 32-BIT DYNAMIC RAM MODULE
Table 1. Connection Table
DATA BLOCK
RASx
SIDE 1
SIDE 2†
DQ0 – DQ7
RAS0
RAS1
DQ8 – DQ15
RAS0
RAS1
DQ16 – DQ23
RAS2
RAS3
DQ24 – DQ31
RAS2
† _{Side 2 applies to the TM248CBJ32F only.}
RAS3
CASx
CAS0
CAS1
CAS2
CAS3
SMMS661 – JANUARY 1996
single in-line memory module and components
PC substrate: 1,27 ± 0,1 mm (0.05 inch) nominal thickness; 0.005 inch / inch maximum warpage
Bypass capacitors: Multilayer ceramic
Contact area for TM124BBJ32F and TM248CBJ32F: Nickel plate and gold plate over copper
Contact area for TM124BBJ32U and TM248CBJ32U: Nickel plate and tin / lead over copper
functional block diagram (TM124BBJ32F and TM248CBJ32F, side 1)
A0 – A9
10
RAS0
W
CAS1
CAS0
10
1M × 16
A0 –A9 DQ0 –
RAS
DQ7
W
LCAS
DQ8 –
UCAS
DQ15
DQ8 – DQ15
DQ0 – DQ7
CAS3
CAS2
functional block diagram (TM248CBJ32F, side 2)
A0 – A9
10
RAS1
W
10
1M × 16
A0 –A9 DQ0 –
RAS
DQ7
W
LCAS
DQ8 –
UCAS
DQ15
DQ24 – DQ31
DQ16 – DQ23
CAS0
CAS1
10
1M × 16
A0 –A9 DQ0 –
RAS
DQ7
W
LCAS
DQ8 –
UCAS
DQ15
DQ0 – DQ7
DQ8 – DQ15
CAS2
CAS3
10
1M × 16
A0 –A9 DQ0 –
RAS
DQ7
W
LCAS
DQ8 –
UCAS
DQ15
DQ16 – DQ23
DQ24 – DQ31
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