TLC372 Datasheet, PDF (3/12 Pages) Texas Instruments – LinCMOSE DUAL DIFFERENTIAL COMPARATORS

TLC372, TLC372Q, TLC372Y
LinCMOS™ DUAL DIFFERENTIAL COMPARATORS
SLCS114B – NOVEMBER 1983 – REVISED MARCH 1999
TLC372Y chip information
These chips, when properly assembled, display characteristics similar to the TLC372C. Thermal compression
or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(6)
(5)
57
(8)
(4)
(1)
(2)
(3)
57
1IN + ⁽³⁾
(2)
1IN –
(7)
2OUT
VCC ₊
(8)
+
–
+
–
(4)
GND
(1)
1OUT
(5)
2IN +
(6)
2IN –
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 3.6 × 3.6 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
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