TL497AC Datasheet, PDF (3/11 Pages) Texas Instruments – SWITCHING VOLTAGE REGULATORS

TL497AC, TL497AI, TL497AY
SWITCHING VOLTAGE REGULATORS
SLVS009C – JUNE 1976 – REVISED AUGUST 1995
TL497AY chip information
This chip, when properly assembled, displays characteristics similar to the TL497AC. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(13) (12)
(14)
68
(11) (10)
(1)
(2) (3)
(4) ₍₅₎ (6)
115
(8)
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax= 150°C
TOLERANCES ARE ± 10%
ALL DIMENSIONS ARE IN MILS
(7)
CUR
LIM BASE
SENS DRIVE† BASE†
FREQ CONTROL ⁽³⁾
(2)
INHIBIT
COMP INPUT ⁽¹⁾
(4)
SUBSTRATE
(6)
CATHODE
(13) (12)
(11)
(10) _COL
OUT
TL497AY
(8) _EMIT
OUT
(7)
ANODE
(5)
(14)
GND VCC
† _{BASE (11) and BASE DRIVE (12) are used for device testing}
only. They are not normally used in circuit applications of the
device.
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