THS7318 Datasheet, PDF (3/10 Pages) Texas Instruments – 3-Channel Low-Power EDTV/SDTV Video Line Driver With Low-Pass Filters

THS7318
www.ti.com
SLOS517A – JANUARY 2007 – REVISED FEBRUARY 2007
PACKAGING/ORDERING INFORMATION
PACKAGED DEVICES
THS7318YZFT
THS7318YZFR
PACKAGE TYPE⁽¹⁾
Wafer Scale 9-pin
PART CODE
BYR
TRANSPORT MEDIA,
QUANTITY
Tape and Reel, 250
Tape and Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
NanoFree™ Placement and Removal Procedures
These procedures are generic guidelines to rework NanoFree™ packages assembled on a 0.056-inch thick FR4
board. It’s recommended to modify heating profiles for different board thicknesses and equipment used. The
assembly process recommended below should be used with a new device. Do not reuse the part after it is
removed.
Air-VacEngineering (www.air-vac-eng.com) has established NanoFree^TM reflow profiles for their Hot Gas
(convection) rework equipment DRS-24NC. The NMX090DVG nozzle is recommended for use with the YZF
package. Customers can use other comparable hot gas (convection) equipment and tooling.
Placement
1. Apply flux paste to component
2. Align device over pads
3. Place device on board. Care must be taken to prevent over-travel during placement which may damage
the part or vacuum tip.
4. Raise nozzle 0.05"
5. Preheat board to 90°C, nozzle warming up 20% air flow, 125°C
6. Soak Stage—20% air flow, 225°C, 90 seconds
7. Ramp Stage—20% air flow, 335°C, 30 seconds
8. Reflow Stage—25% air flow, 370°C, 65 seconds
9. Cool down Stage—40% air flow, 25°C, 50 seconds
Removal
1. Apply flux paste to component
2. Align Nozzle over part to be removed
3. Maintain nozzle 0.050"over device. Care must be taken to prevent over-travel of the vacuum tip which
may damage the part or vacuum tip when measuring this distance.
4. Preheat board to 90°C, nozzle warming up 20% air flow, 125°C
5. Soak Stage—20% air flow, 225°C, 90 seconds
6. Ramp Stage—20% air flow, 335°C, 30 seconds
7. Reflow Stage—25% air flow, 370°C, 65 seconds
8. Enable Vacuum at the end of the reflow cycle, lower vacuum nozzle, and remove part
9. Cool down Stage—40% air flow, 25°C, 50 seconds
10. Turn off the vacuum and remove part from nozzle.
11. Care should be used if the device is to be returned to TI for failure analysis. Using any metal tweezers or
rough handling can damage the part, and render it un-analyzable.
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