THS7318 Datasheet, PDF (2/10 Pages) Texas Instruments – 3-Channel Low-Power EDTV/SDTV Video Line Driver With Low-Pass Filters

THS7318
SLOS517A – JANUARY 2007 – REVISED FEBRUARY 2007
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
VALUE
UNIT
V_SS
Supply voltage, V_S+ to GND
V_I
Input voltage
I_O
Output current
Continuous power dissipation
5.5
V
–0.4 to V_S+
V
±100
mA
See Dissipation Rating Table
Any condition ⁽²⁾
150
°C
T_J
Maximum junction temperature
Continuous operation, long term reliability⁽³⁾
125
°C
T_stg
Storage temperature range
HBM
–65 to 150
°C
2000
V
ESD ratings
CDM
1500
V
MM
200
V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS⁽¹⁾
PACKAGE
YZF
θ_JC
(°C/W)
38
θ_JA
(°C/W)
105
POWER RATING⁽²⁾
(T_J = 125°C)
T_A = 25°C
T_A = 70°C
950 mW
428 mW
(1) This data was taken with the JEDEC High-K test PCB.
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase and
long-term reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125°C for best performance and reliability.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
V_S+
Supply voltage
T_A
Ambient temperature
MIN
MAX
UNIT
2.85
5
V
0
70
°C
2
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