THS3120 Datasheet, PDF (3/28 Pages) Texas Instruments – LOW-NOISE, HIGH-OUTPUT DRIVE, CURRENT-FEEDBACK, OPERATIONAL AMPLIFIERS

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RECOMMENDED OPERATING CONDITIONS
Supply voltage
Dual supply
Single supply
Operating free-air temperature, T_A
Commercial
Industrial
Operating junction temperature, continuous operating, T_J
Normal storage temperature, T_stg
THS3120, THS3121
SLOS420A – SEPTEMBER 2003 – REVISED NOVEMBER 2003
MIN
NOM
MAX
UNIT
±5
±15
V
10
30
0
70
°C
-40
85
-40
125
°C
-40
85
°C
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature (unless otherwise noted)⁽¹⁾
Supply voltage, V_S- to V_S+
Input voltage, V_I
Differential input voltage, V_ID
Output current, I_O(2)
Continuous power dissipation
Maximum junction temperature, T_J(3)
Maximum junction temperature, continuous operation, long term reliability, T_J(4)
Operating free-air temperature, T_A
Commercial
Industrial
Storage temperature, T_stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
ESD ratings:
HBM
CDM
MM
UNIT
33 V
± V_S
±4V
550 mA
See Dissipation Ratings Table
150°C
125°C
0°C to 70°C
-40°C to 85°C
-65°C to 125°C
300°C
1000
1500
200
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under,, recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The THS3120 and THS3121 may incorporate a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD™ thermally enhanced package.
(3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process.
(4) The maximum junction temperature for continuous operation is limited by the package constraints. Operation above this temperature
may result in reduced reliability and/or lifetime of the device.
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