THMC10 Datasheet, PDF (3/20 Pages) Texas Instruments – REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE

THMC10
REMOTE/LOCAL TEMPERATURE MONITOR
WITH SMBus INTERFACE
SLIS089 – DECEMBER 1999
Terminal Functions
TERMINAL
NAME
NO.
ADD0
10
ADD1
6
ALERT
11
DXN
4
DXP
GND
N/C
SCLK
SDATA
STBY
VDD
3
7, 8
1, 5, 9,
13, 16
14
12
15
2
I/O
DESCRIPTION
I SMBus address select terminal 0 (Note: Excess capacitance on this terminal may cause SMBus address
recognition problems.)
I SMBus address select terminal 1 (Note: Excess capacitance on this terminal may cause SMBus address
recognition problems.)
O Active low temperature interrupt signal
I/O Current sink for external diode connected transistor and A/D negative input (Do not leave floating if no external
diode is used – should be tied to GND.)
I/O Current source for external diode connected transistor and A/D positive input
I IC ground
N/C No connection
I SMBus serial clock input terminal – clock signal for SMBus serial data
I/O SMBus serial data I/O terminal – serial data I/O for SMBus
I Active low standby mode input
I IC supply voltage – should be decoupled with external 0.1 µF capacitor
absolute maximum ratings over operating case temperature (see Note 1) (unless otherwise noted)^†
Input voltage on: V_DD supply terminal, V_(DDIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 6 V
I/O terminals, V_(IOIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to V_DD + 0.3 V
SMBus terminals, V_(SMBIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 6 V
DXN terminal, V_(DXN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 0.8 V
SMBus input/output current, I_(SMBIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –1 mA to 50 mA
DXN input current, I_(DXN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –1 mA to 1 mA
Continuous power dissipation, P_D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330 mW
Operating case temperature range, T_C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 165°C
Junction temperature, T_J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature (soldering, 10 sec), T_(LEAD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to GND.
recommended operating conditions
Supply voltage, VDD
SMBus input high voltage, VIH
SMBus input low voltage, VIL
SMBus operating frequency, f(SCLK)
Operating ambient temperature, TA
MIN MAX UNITS
3 3.6 V
2.2
V
0.8 V
10 100 kHz
0
85 °C
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