OPA330_15 Datasheet, PDF (3/37 Pages) Texas Instruments – 50μV VOS, 0.25μV/°C, 35μA CMOS OPERATIONAL AMPLIFIERS Zerø-Drift Series

www.ti.com
OPA330
OPA2330
OPA4330
SBOS432E – AUGUST 2008 – REVISED FEBRUARY 2011
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
OPA330AID(R)
D
8 PINS
140.1
89.8
80.6
28.7
80.1
n/a
OPA330AIDBVR(T)
DBV
5 PINS
220.8
97.5
61.7
7.6
61.1
n/a
OPA330AIDCKR(T)
DCK
5 PINS
298.4
65.4
97.1
0.8
95.5
n/a
OPA330AIYFF
YFF
5 PINS
130
54
51
1
50
n/a
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
OPA2330AID(R)
D
8 PINS
124.0
73.7
64.4
18.0
63.9
n/a
OPA2330AIDGKR(T)
DGK
8 PINS
180.3
48.1
100.9
2.4
99.3
n/a
OPA2330AIDRBR(T)
DRB
8 PINS
46.7
26.3
22.2
1.6
22.3
10.1
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
OPA4330AID
D
14 PINS
83.8
70.7
59.5
11.6
37.7
n/a
OPA4330AIPW
PW
14 PINS
120.8
34.3
62.8
1.0
56.5
n/a
OPA4330AIRGY
RGY
14 PINS
49.2
75.3
61.9
1.2
19.3
4.6
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
© 2008–2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): OPA330 OPA2330 OPA4330