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MSP430G2302-EP Datasheet, PDF (3/48 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER
MSP430G2302-EP
www.ti.com
SLAS868 – JUNE 2012
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE PINOUTS
PW PACKAGE
(TOP VIEW)
DVCC 1
P1.0/TA0CLK/ACLK/A0 2
P1.1/TA0.0/A1 3
P1.2/TA0.1/A2 4
P1.3/ADC10CLK/A3/VREF-/VEREF- 5
P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/TCK 6
P1.5/TA0.0/SCLK/A5/TMS 7
14 DVSS
13 XIN/P2.6/TA0.1
12 XOUT/P2.7
11 TEST/SBWTCK
10 RST/NMI/SBWTDIO
9 P1.7/SDI/SDA/A7/TDO/TDI
8 P1.6/TA0.1/SDO/SCL/A6/TDI/TCLK
NOTE: The pulldown resistors of port pins P2.0, P2.1, P2.2, P2.3, P2.4, and P2.5 should be enabled by setting P2REN.x = 1.
Copyright © 2012, Texas Instruments Incorporated
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