THS6012 Datasheet, PDF (28/35 Pages) Texas Instruments – 500-mA DUAL DIFFERENTIAL LINE DRIVER

THS6012
500-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS226C– SEPTEMBER 1998 – REVISED FEBRUARY 2000
APPLICATION INFORMATION
PCB design considerations (continued)
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package. This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
9
TJ = 150°C
8
PCB Size = 3” x 3”
No Air Flow
7
θ_JA = 21.5°C/W
6
2 oz Trace and
Copper Pad
5
with Solder
4
3
θ_JA = 43.9°C/W
2 ^{2 oz Trace and Copper Pad}
without Solder
1
0
–40 –20 0
20 40 60 80 100
TA – Free-Air Temperature – °C
Figure 46. Maximum Power Dissipation vs Free-Air Temperature
28
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