THS6012 Datasheet, PDF (21/35 Pages) Texas Instruments – 500-mA DUAL DIFFERENTIAL LINE DRIVER

THS6012
500-mA DUAL DIFFERENTIAL LINE DRIVER
SLOS226C– SEPTEMBER 1998 – REVISED FEBRUARY 2000
APPLICATION INFORMATION
thermal information
The THS6012 is packaged in a thermally-enhanced DWP package, which is a member of the PowerPAD family
of packages. This package is constructed using a downset leadframe upon which the die is mounted
[see Figure 39(a) and Figure 39(b)]. This arrangement results in the lead frame being exposed as a thermal pad
on the underside of the package [see Figure 39(c)]. Because this thermal pad has direct thermal contact with
the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal
pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device. This
is discussed in more detail in the PCB design considerations section of this document.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
Thermal
Pad
DIE
End View (b)
Bottom View (c)
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 39. Views of Thermally Enhanced DWP Package
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