THS4601 Datasheet, PDF (26/27 Pages) Texas Instruments – WIDEBAND, FET-INPUT OPERATIONAL AMPLIFIER

THS4601
SLOS388B – OCTOBER 2001 – REVISED JUNE 2002
DDA (S–PDSO–G8)
MECHANICAL DATA
Power PADt PLASTIC SMALL-OUTLINE
1,27
8
0,49
0,35
5
0,10 M
3,99 6,20
3,81 5,84
1
4
4,98
4,80
1,68 MAX
Thermal Pad
(See Note D)
0,20 NOM
Gage Plane
0°–8°
Seating Plane
1,55
0,10
0,13
1,40
0,03
0,25
0,89
0,41
4202561/A 02/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
PowerPAD is a trademark of Texas Instruments.
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