THS3001 Datasheet, PDF (25/32 Pages) Texas Instruments – 420-MHz HIGH-SPEED CURRENT-FEEDBACK AMPLIFIERS

THS3001, THS3002
420-MHz HIGH-SPEED CURRENT-FEEDBACK AMPLIFIERS
APPLICATION INFORMATION
SLOS217A – JULY 1998 – REVISED JUNE 1999
thermal information (continued)
+ ǒ Ǔ ^{The thermal coefficient θJA is approximately 169°C/W for the SOIC 8-pin D package. For a given θJA, the}
maximum power dissipation, shown in Figure 56, is calculated by the following formula:
PD
TMAX–TA
q_JA
Where:
P_D = Maximum power dissipation of THS300x (watts)
T_MAX = Absolute maximum junction temperature (150°C)
T_A = Free-ambient air temperature (°C)
θ_JA = Thermal coefficient from die junction to ambient air (°C/W)
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
1.5
SOIC-D Package:
θ_JA = 169°C/W
TJ = 150°C
No Airflow
1
0.5
0
–40 –20 0 20 40 60 80 100
TA – Free-Air Temperature – °C
Figure 56. Maximum Power Dissipation vs Free-Air Temperature
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